The success of the Ball Grid Array (BGA) devices in several products related to telecommunications, consumer, office use, and more, has led to engineers experimenting and implementing stacking of packages for even higher densities. These stacked packages, termed Package on Package or PoP are simply one or more BGA packages stacked one on top of another. Broadly, there are two versions—one where the original component manufacturer stacks the packages, and the other where the printed board assembler stacks them. The main advantage of PoP is substantially enhanced functionality within the same footprint of a single BGA.
https://www.pcbpower.com/blog-detail/how-do-you-assemble-pop-components
#MakeInIndia #SupportMakeInIndia #pcbmanufacturers #electronics #pcbelectronics #pcbdesigners #PCBPowerMarket #pcbassembly #pcbmanufacturing #pcbdesign #pcb #printedcircuitboard #electricalengineering #electronicsengineering #pcblayout #ceramicpcb #pcbsoldering #LocalKoVocal #BeVocalForLocal #bePCBwise
The success of the Ball Grid Array (BGA) devices in several products related to telecommunications, consumer, office use, and more, has led to engineers experimenting and implementing stacking of packages for even higher densities. These stacked packages, termed Package on Package or PoP are simply one or more BGA packages stacked one on top of another. Broadly, there are two versions—one where the original component manufacturer stacks the packages, and the other where the printed board assembler stacks them. The main advantage of PoP is substantially enhanced functionality within the same footprint of a single BGA. https://www.pcbpower.com/blog-detail/how-do-you-assemble-pop-components #MakeInIndia #SupportMakeInIndia #pcbmanufacturers #electronics #pcbelectronics #pcbdesigners #PCBPowerMarket #pcbassembly #pcbmanufacturing #pcbdesign #pcb #printedcircuitboard #electricalengineering #electronicsengineering #pcblayout #ceramicpcb #pcbsoldering #LocalKoVocal #BeVocalForLocal #bePCBwise
