It is very important that an ideal surface finish be selected for a PCB The high assembly density and Ball Grid Array BGA have led to the higher usage of electronic packages for commercial applications Besides the Hot Air Solder Level HASL HAL there are many other surface finishes too to fulfill the advanced assembly needs With each finish having its individual benefits and limitations the ideal choice on a product s application

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It is very important that an ideal surface finish be selected for a PCB. The high assembly density and Ball Grid Array (BGA) have led to the higher usage of electronic packages for commercial applications. Besides the Hot Air Solder Level (HASL / HAL), there are many other surface finishes too to fulfill the advanced assembly needs. With each finish having its individual benefits and limitations, the ideal choice on a product’s application.

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It is very important that an ideal surface finish be selected for a PCB. The high assembly density and Ball Grid Array (BGA) have led to the higher usage of electronic packages for commercial applications. Besides the Hot Air Solder Level (HASL / HAL), there are many other surface finishes too to fulfill the advanced assembly needs. With each finish having its individual benefits and limitations, the ideal choice on a product’s application. https://www.pcbpower.com/Pcbpower/sign-in #SupportMakeInIndia #pcbmanufacturers #electronics #pcbelectronics #pcbdesigners #PCBPowerMarket #pcbassembly #pcbmanufacturing #pcbdesign #pcb #printedcircuitboard #electricalengineering #electronicsengineering #pcblayout #ceramicpcb #pcbsoldering #LocalKoVocal #BeVocalForLocal

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